Manual Crystal Wafer Grinder from China
Hand-operated grinder for processing semiconductor crystal boules to precise diameters, creating flats for conductivity indication as per statistical notes. Classified under HTS 8460.40.80.20 for grinding machines finishing metal/cermets, low-value. Essential in wafer preparation workflow.
Duty Rate — China → United States
41.9%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Document crystal grinding function with photos/specs; distinguish from general metal grinders
• Ensure valuation excludes software or accessories to stay under $3,025 threshold
• Obtain manufacturer's declaration linking to semiconductor statistical note (a)(ii)(A)