Manual Crystal Wafer Grinder from Mexico

Hand-operated grinder for processing semiconductor crystal boules to precise diameters, creating flats for conductivity indication as per statistical notes. Classified under HTS 8460.40.80.20 for grinding machines finishing metal/cermets, low-value. Essential in wafer preparation workflow.

Duty Rate — Mexico → United States

14.4%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter

Import Tips

Document crystal grinding function with photos/specs; distinguish from general metal grinders

Ensure valuation excludes software or accessories to stay under $3,025 threshold

Obtain manufacturer's declaration linking to semiconductor statistical note (a)(ii)(A)