Swivel Head Internal Cylindrical Grinder
Precision grinder with swivel wheelhead for angular internal cylindrical finishing of metal ferrules in fiber optic connectors used in semiconductor testing. HTS 8460.29.0130 for other internal cylindrical metal grinding machines.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If primarily for lapping operations
Lapping uses loose abrasives vs bonded wheels of grinding machines.
If as semiconductor test handler component
Integrated into semiconductor testing machines per Chapter 84 statistical notes.
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Import Tips & Compliance
• Include angle adjustment range specs; distinguishes from fixed-head grinders
• Calibrate dressers before import inspection; non-compliant abrasives cause delays
• Declare vibration isolation features affecting classification precision level
Related Products under HTS 8460.29.01.30
CNC Internal Cylindrical Grinder
A computer numerically controlled machine tool designed for precision grinding of internal cylindrical surfaces on metal parts using abrasive wheels. It falls under HTS 8460.29.0130 as an other internal cylindrical grinding machine for finishing metal surfaces to tight tolerances in semiconductor wafer processing equipment components.
Precision Internal Diameter Grinder for Bearing Races
Specialized grinding machine for finishing internal cylindrical surfaces of ball bearing races and semiconductor component housings using high-precision abrasives. Classified in HTS 8460.29.0130 for other internal cylindrical grinding machines finishing metal precision parts.
Air Bearing Internal Cylindrical Grinding Machine
Advanced grinder utilizing air bearings for ultra-precise internal cylindrical finishing of metal sleeves used in semiconductor handlers and testers. HTS 8460.29.0130 covers this as other internal cylindrical grinding machine for metal surface finishing.
Hydraulic Internal Grinder for Cylinder Bores
Machine tool with hydraulic workhead for grinding internal cylindrical bores in metal engine components and semiconductor vacuum chamber parts. Falls under HTS 8460.29.0130 as other internal cylindrical grinding equipment for metal finishing.
High-Speed Internal Profile Grinder
Machine for grinding complex internal cylindrical profiles in metal molds for semiconductor leadframes using high-speed CBN wheels. Classified HTS 8460.29.0130 as other internal cylindrical finishing grinder.
Nano-Precision Internal Bore Grinder
Ultra-precision grinder achieving sub-micron tolerances on internal cylindrical bores for metal shafts in semiconductor wafer probers. HTS 8460.29.0130 covers other internal cylindrical metal grinders.