CNC Internal Cylindrical Grinder
A computer numerically controlled machine tool designed for precision grinding of internal cylindrical surfaces on metal parts using abrasive wheels. It falls under HTS 8460.29.0130 as an other internal cylindrical grinding machine for finishing metal surfaces to tight tolerances in semiconductor wafer processing equipment components.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If equipped for both internal and external grinding
Universal cylindrical grinders capable of both internal and external operations are classified separately from dedicated internal machines.
If primarily for honing rather than grinding
Honing machines use different abrasive processes and fall under separate subheadings even for internal cylindrical finishing.
If classified as semiconductor wafer processing equipment
Per statistical notes, certain wafer grinders/polishers for semiconductor materials may shift to Chapter 84 machines for semiconductor manufacturing.
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Import Tips & Compliance
• Verify machine specifications confirm internal cylindrical grinding capability for metal; provide technical datasheets to CBP for classification
• Ensure CE marking or equivalent for safety compliance; common pitfall is misclassification as universal grinder under 8460.29.0135
• Declare value accurately excluding software; obtain rulings for machines with integrated honing functions
Related Products under HTS 8460.29.01.30
Precision Internal Diameter Grinder for Bearing Races
Specialized grinding machine for finishing internal cylindrical surfaces of ball bearing races and semiconductor component housings using high-precision abrasives. Classified in HTS 8460.29.0130 for other internal cylindrical grinding machines finishing metal precision parts.
Air Bearing Internal Cylindrical Grinding Machine
Advanced grinder utilizing air bearings for ultra-precise internal cylindrical finishing of metal sleeves used in semiconductor handlers and testers. HTS 8460.29.0130 covers this as other internal cylindrical grinding machine for metal surface finishing.
Hydraulic Internal Grinder for Cylinder Bores
Machine tool with hydraulic workhead for grinding internal cylindrical bores in metal engine components and semiconductor vacuum chamber parts. Falls under HTS 8460.29.0130 as other internal cylindrical grinding equipment for metal finishing.
Swivel Head Internal Cylindrical Grinder
Precision grinder with swivel wheelhead for angular internal cylindrical finishing of metal ferrules in fiber optic connectors used in semiconductor testing. HTS 8460.29.0130 for other internal cylindrical metal grinding machines.
High-Speed Internal Profile Grinder
Machine for grinding complex internal cylindrical profiles in metal molds for semiconductor leadframes using high-speed CBN wheels. Classified HTS 8460.29.0130 as other internal cylindrical finishing grinder.
Nano-Precision Internal Bore Grinder
Ultra-precision grinder achieving sub-micron tolerances on internal cylindrical bores for metal shafts in semiconductor wafer probers. HTS 8460.29.0130 covers other internal cylindrical metal grinders.