DoAll DSG-1224 Vertical Spindle Surface Grinder

Vertical spindle reciprocating table grinder for precision finishing of hardened metal surfaces with abrasive products. Under HTS 8460.19.0150 as other flat-surface grinding machines for metal finishing. Critical for semiconductor wafer grinding preparation per statistical notes.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳China4.4%+35.0%39.4%
🇲🇽Mexico4.4%+10.0%14.4%
🇨🇦Canada4.4%+10.0%14.4%
🇩🇪Germany4.4%+10.0%14.4%
🇯🇵Japan4.4%+10.0%14.4%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8460.90Lower: 14.4% vs 39.4%

If includes multiple functions beyond flat-surface grinding

Machines workable for other functions like honing classify under other subheadings in 8460.

8479.82.00Lower: 35% vs 39.4%

If dedicated to semiconductor wafer surface preparation

Statistical note (c) covers wafer grinders under semiconductor manufacturing machines.

8207.90Lower: 13.7% vs 39.4%

If imported as interchangeable abrasive tools only

Grinding stones/abrasives alone classify as tools, not machines.

Not sure which classification is right?

Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.

Import Tips & Compliance

Include vibration analysis reports for cleanroom compatibility in semiconductor declarations

Document abrasive wheel specifications to confirm classification over polishing machines

Beware anti-dumping duties on Asian-origin grinders; verify country of origin accurately

Related Products under HTS 8460.19.01.50

Chevalier FSG-1224ADIV High-Precision Flat-Surface Grinder

This numerically controlled flat-surface grinding machine is designed for finishing flat metal surfaces using abrasive wheels, achieving tolerances down to 0.0001 inches. It falls under HTS 8460.19.0150 as a flat-surface grinding machine for metal other than gear-related, used in semiconductor wafer processing for precise surface preparation. Ideal for high-volume production in precision industries.

Okamoto ACC-3224DXNC Precision Surface Grinder

A CNC-controlled surface grinder for lapping and polishing flat metal workpieces to mirror finishes, commonly used in tool and die shops. Classified under HTS 8460.19.0150 for other flat-surface grinding machines finishing metal via abrasives, excluding gear types. Essential for preparing semiconductor manufacturing tools.

Kent KGS-84AH Industrial Flat Bed Grinder

Heavy-duty flat-surface grinder with hydraulic table for deburring and finishing large metal plates using grinding stones. HTS 8460.19.0150 applies to this other flat-surface type for metal or cermets, not gear finishing. Widely used in semiconductor fab equipment maintenance.

Mitsubishi PAG6-60S Horizontal Surface Grinder

High-speed horizontal flat-surface grinder for lapping metal and cermet parts to optical flatness. Fits HTS 8460.19.0150 for other non-gear flat grinders using polishing products. Used in semiconductor boule grinding per chapter notes.

Boyar-Schultz 612 Micro-Cut Surface Grinder

Compact manual flat-surface grinder for ultra-precision finishing of small metal components with fine abrasives. HTS 8460.19.0150 covers this other flat grinder for metal deburring/sharpening. Suitable for semiconductor crystal grinder applications.

Harig 5SBP Super 612 Surface Grinder

Robust super-precision flat grinder for honing and polishing carbide tools and metal inserts via grinding stones. Under HTS 8460.19.0150 as other flat-surface machines for cermets/metal finishing. Key for semiconductor wafer prep tooling.