Okamoto ACC-3224DXNC Precision Surface Grinder
A CNC-controlled surface grinder for lapping and polishing flat metal workpieces to mirror finishes, commonly used in tool and die shops. Classified under HTS 8460.19.0150 for other flat-surface grinding machines finishing metal via abrasives, excluding gear types. Essential for preparing semiconductor manufacturing tools.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If for non-flat surface grinding like cylindrical operations
Different surface geometries shift to other grinding machine subheadings within 8460.
If specialized solely for semiconductor wafer lapping, not general metal
Statistical notes may direct wafer-specific machines to Chapter 84 machines for semiconductor manufacturing.
If equipped primarily for measuring flatness rather than grinding
Measuring or checking instruments with incidental grinding classify under Chapter 90.
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Import Tips & Compliance
• Provide OEM manuals confirming abrasive-based metal finishing to distinguish from lapping-only machines
• Declare full value including software licenses; common pitfall is splitting shipments to evade thresholds
• Obtain prior FDA or environmental certifications if used in cleanroom semiconductor applications
Related Products under HTS 8460.19.01.50
Chevalier FSG-1224ADIV High-Precision Flat-Surface Grinder
This numerically controlled flat-surface grinding machine is designed for finishing flat metal surfaces using abrasive wheels, achieving tolerances down to 0.0001 inches. It falls under HTS 8460.19.0150 as a flat-surface grinding machine for metal other than gear-related, used in semiconductor wafer processing for precise surface preparation. Ideal for high-volume production in precision industries.
Kent KGS-84AH Industrial Flat Bed Grinder
Heavy-duty flat-surface grinder with hydraulic table for deburring and finishing large metal plates using grinding stones. HTS 8460.19.0150 applies to this other flat-surface type for metal or cermets, not gear finishing. Widely used in semiconductor fab equipment maintenance.
DoAll DSG-1224 Vertical Spindle Surface Grinder
Vertical spindle reciprocating table grinder for precision finishing of hardened metal surfaces with abrasive products. Under HTS 8460.19.0150 as other flat-surface grinding machines for metal finishing. Critical for semiconductor wafer grinding preparation per statistical notes.
Mitsubishi PAG6-60S Horizontal Surface Grinder
High-speed horizontal flat-surface grinder for lapping metal and cermet parts to optical flatness. Fits HTS 8460.19.0150 for other non-gear flat grinders using polishing products. Used in semiconductor boule grinding per chapter notes.
Boyar-Schultz 612 Micro-Cut Surface Grinder
Compact manual flat-surface grinder for ultra-precision finishing of small metal components with fine abrasives. HTS 8460.19.0150 covers this other flat grinder for metal deburring/sharpening. Suitable for semiconductor crystal grinder applications.
Harig 5SBP Super 612 Surface Grinder
Robust super-precision flat grinder for honing and polishing carbide tools and metal inserts via grinding stones. Under HTS 8460.19.0150 as other flat-surface machines for cermets/metal finishing. Key for semiconductor wafer prep tooling.