Qsonica Q700 Ultrasonic Cell Disruptor

The Qsonica Q700 is a benchtop ultrasonic disruptor designed for lysing cells and extracting biomolecules through cavitation-induced material breakdown. It qualifies under HTS 8456.20.5000 as an 'other' ultrasonic machine tool for removing material via ultrasonic processes, applicable to biotech research outside semiconductor fabrication.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳China2.4%+35.0%37.4%
🇲🇽Mexico2.4%+10.0%12.4%
🇨🇦Canada2.4%+10.0%12.4%
🇩🇪Germany2.4%+10.0%12.4%
🇯🇵Japan2.4%+10.0%12.4%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

9018.90.75Lower: 35% vs 37.4%

If exclusively for medical sample analysis without industrial-scale removal

Lab instruments for ultrasonic medical sample prep classify in Chapter 90 as medical/lab apparatus, not machine tools.

8479.82.00Lower: 35% vs 37.4%

If adapted for nanoparticle synthesis in semiconductor doping processes

Ultrasonic dispersers for semiconductor material processing fall under Chapter 84 semiconductor machines per statistical notes.

Not sure which classification is right?

Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.

Import Tips & Compliance

Include biocompatibility certifications for probe materials to meet biotech import standards; avoid generic 'lab equipment' descriptions

Document probe sizes and amplitudes to prove material disruption capability over mere sonication

Related Products under HTS 8456.20.50.00

Sonics Vibracell VCX750 Ultrasonic Processor

The Sonics Vibracell VCX750 is an ultrasonic liquid processor used for cell disruption, homogenization, and particle size reduction by generating ultrasonic waves that create cavitation in materials. It falls under HTS 8456.20.5000 as a machine tool operated by ultrasonic processes for material removal through erosion and cavitation, distinct from semiconductor-specific wafer processing equipment. This versatile lab tool is employed in pharmaceuticals, cosmetics, and nanotechnology for non-wafer applications.

Hielscher UIP1000hdT Ultrasonic Homogenizer

Hielscher's UIP1000hdT is an industrial ultrasonic processor for emulsification, dispersion, and wet milling through high-intensity ultrasonic cavitation that removes material at a microscopic level. Classified under HTS 8456.20.5000 for 'other' ultrasonic-operated machine tools performing material removal processes beyond semiconductor wafers. Commonly used in food processing, chemicals, and biofuels for particle size reduction.

Omni International Omni Ruptor 4000

Omni Ruptor 4000 ultrasonic homogenizer excels in nanoparticle deagglomeration and sample preparation by ultrasonic cavitation erosion. Under HTS 8456.20.5000 for general ultrasonic material working machines, not limited to semiconductor wafers or testing.

Bandelin Sonopuls HD 3200 Ultrasonic Homogenizer

Bandelin Sonopuls HD 3200 provides high-energy ultrasonic treatment for disintegration and emulsification via material-eroding cavitation waves. Classified HTS 8456.20.5000 as other ultrasonic process machine tools for diverse industrial material working.

Misonix Sonicator S-4000

Misonix S-4000 ultrasonic processor for advanced materials research, achieving uniform particle size reduction through precise cavitation control. HTS 8456.20.5000 covers this as non-semiconductor ultrasonic material removal equipment.