Other
Machine tools for working any material by removal of material, by laser or other light or photon beam, ultrasonic, electro-discharge, electro-chemical, electron-beam, ionic-beam or plasma arc processes; water-jet cutting machines: > Operated by ultrasonic processes: > Other
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8456.20.50.00
Sonics Vibracell VCX750 Ultrasonic Processor
The Sonics Vibracell VCX750 is an ultrasonic liquid processor used for cell disruption, homogenization, and particle size reduction by generating ultrasonic waves that create cavitation in materials. It falls under HTS 8456.20.5000 as a machine tool operated by ultrasonic processes for material removal through erosion and cavitation, distinct from semiconductor-specific wafer processing equipment. This versatile lab tool is employed in pharmaceuticals, cosmetics, and nanotechnology for non-wafer applications.
Hielscher UIP1000hdT Ultrasonic Homogenizer
Hielscher's UIP1000hdT is an industrial ultrasonic processor for emulsification, dispersion, and wet milling through high-intensity ultrasonic cavitation that removes material at a microscopic level. Classified under HTS 8456.20.5000 for 'other' ultrasonic-operated machine tools performing material removal processes beyond semiconductor wafers. Commonly used in food processing, chemicals, and biofuels for particle size reduction.
Omni International Omni Ruptor 4000
Omni Ruptor 4000 ultrasonic homogenizer excels in nanoparticle deagglomeration and sample preparation by ultrasonic cavitation erosion. Under HTS 8456.20.5000 for general ultrasonic material working machines, not limited to semiconductor wafers or testing.
Bandelin Sonopuls HD 3200 Ultrasonic Homogenizer
Bandelin Sonopuls HD 3200 provides high-energy ultrasonic treatment for disintegration and emulsification via material-eroding cavitation waves. Classified HTS 8456.20.5000 as other ultrasonic process machine tools for diverse industrial material working.
Misonix Sonicator S-4000
Misonix S-4000 ultrasonic processor for advanced materials research, achieving uniform particle size reduction through precise cavitation control. HTS 8456.20.5000 covers this as non-semiconductor ultrasonic material removal equipment.
Qsonica Q700 Ultrasonic Cell Disruptor
The Qsonica Q700 is a benchtop ultrasonic disruptor designed for lysing cells and extracting biomolecules through cavitation-induced material breakdown. It qualifies under HTS 8456.20.5000 as an 'other' ultrasonic machine tool for removing material via ultrasonic processes, applicable to biotech research outside semiconductor fabrication.