Sonics Vibragran Ultrasonic Machining Center
This ultrasonic machining center uses high-frequency vibrations and abrasive slurry to remove material from hard metals like titanium and hardened steel, ideal for precision aerospace components. It falls under HTS 8456.20.1050 as a metal-working machine operated by ultrasonic processes, distinct from simpler ultrasonic cleaners. Primarily used in semiconductor and medical device manufacturing for intricate hole drilling.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If used solely for semiconductor wafer processing
Machines specifically for semiconductor manufacture or test may shift to 8466.91 per statistical notes, if proven end-use in wafer prep like grinding.
If operated by laser instead of ultrasonic
Laser-based material removal for metal changes heading to 8456.10, as process type dictates primary classification.
If for industrial testing of metal parts, not production machining
If primarily for measuring or testing rather than material removal, it falls under Chapter 90 optical/measuring machines.
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
• Verify machine specs confirm ultrasonic vibration for material removal, not just cleaning; provide technical datasheets on frequency and amplitude
• Ensure export licenses from origin if dual-use tech
• Common pitfall: misclassifying as Chapter 84 ultrasonic cleaners
Related Products under HTS 8456.20.10.50
DMG Mori ULTRASONIC 20 Linear Machine Tool
A 5-axis CNC ultrasonic machine tool integrating ultrasonic oscillation for machining hard metals such as Inconel and carbide, producing complex molds and dies. Classified under HTS 8456.20.1050 for its ultrasonic process on metals, excluding water-jet variants. Essential for high-precision parts in turbine blades and semiconductor tooling.
Haas UMC-1000 Ultrasonic Milling Machine
Compact ultrasonic-assisted milling machine for metals, employing sonic energy to enhance tool life when cutting superalloys and ceramics. HTS 8456.20.1050 applies to this 'other' ultrasonic metal remover, beyond basic grinders. Used for prototyping intricate metal features in electronics and medical implants.
OptiPro eSX Ultrasonic Machining System
Precision ultrasonic system for micro-machining metals, creating features down to 50 microns in stainless steel and tungsten. Falls under HTS 8456.20.1050 as other ultrasonic metalworking equipment. Critical for semiconductor mold inserts and optical components.
Sonotec USM 500 Ultrasonic Tool
Industrial ultrasonic machining tool for drilling blind holes in hard metals without burrs, using abrasive slurry vibration. HTS 8456.20.1050 for other ultrasonic metal processes. Applied in semiconductor leadframe production and watchmaking.
Mikro SonicMaster Ultrasonic Lathe
Ultrasonic-enhanced lathe for turning difficult-to-cut metals like molybdenum, reducing tool wear via sonic assistance. Classified HTS 8456.20.1050 as other ultrasonic metalworking. Suited for semiconductor heat sink prototypes.