DMG Mori ULTRASONIC 20 Linear Machine Tool
A 5-axis CNC ultrasonic machine tool integrating ultrasonic oscillation for machining hard metals such as Inconel and carbide, producing complex molds and dies. Classified under HTS 8456.20.1050 for its ultrasonic process on metals, excluding water-jet variants. Essential for high-precision parts in turbine blades and semiconductor tooling.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If configured for machining semiconductor crystal boules
Statistical notes may direct boule-working tools to 8457.10 for semiconductor-specific use like crystal grinding/pulling.
If primarily for numerical control bending, not removal
CNC metalworking machines without removal process shift to 8462 if focused on forming rather than ultrasonic ablation.
If imported as part of a larger semiconductor fab set
If sold as a complete set for semiconductor processing, it may classify under 8479 for machines not elsewhere specified.
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Import Tips & Compliance
• Include vibration frequency certification (>20kHz) and metalworking demos to avoid reclassification
• Label as 'other' ultrasonic explicitly
• Pitfall: overlooking BIS export controls for high-precision tech
Related Products under HTS 8456.20.10.50
Sonics Vibragran Ultrasonic Machining Center
This ultrasonic machining center uses high-frequency vibrations and abrasive slurry to remove material from hard metals like titanium and hardened steel, ideal for precision aerospace components. It falls under HTS 8456.20.1050 as a metal-working machine operated by ultrasonic processes, distinct from simpler ultrasonic cleaners. Primarily used in semiconductor and medical device manufacturing for intricate hole drilling.
Haas UMC-1000 Ultrasonic Milling Machine
Compact ultrasonic-assisted milling machine for metals, employing sonic energy to enhance tool life when cutting superalloys and ceramics. HTS 8456.20.1050 applies to this 'other' ultrasonic metal remover, beyond basic grinders. Used for prototyping intricate metal features in electronics and medical implants.
OptiPro eSX Ultrasonic Machining System
Precision ultrasonic system for micro-machining metals, creating features down to 50 microns in stainless steel and tungsten. Falls under HTS 8456.20.1050 as other ultrasonic metalworking equipment. Critical for semiconductor mold inserts and optical components.
Sonotec USM 500 Ultrasonic Tool
Industrial ultrasonic machining tool for drilling blind holes in hard metals without burrs, using abrasive slurry vibration. HTS 8456.20.1050 for other ultrasonic metal processes. Applied in semiconductor leadframe production and watchmaking.
Mikro SonicMaster Ultrasonic Lathe
Ultrasonic-enhanced lathe for turning difficult-to-cut metals like molybdenum, reducing tool wear via sonic assistance. Classified HTS 8456.20.1050 as other ultrasonic metalworking. Suited for semiconductor heat sink prototypes.