Compound Semiconductor Polishing Roll
Roll optimized for polishing compound semiconductors like GaN, InP for LED/photonics applications, providing damage-free surfaces. HTS 8455.30.00.65 covers <2,268 kg rolling mill rolls for semiconductor wafer finishing. Handles brittle materials without subsurface damage.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If for optical element finishing
Optics grinding/polishing machines if marketed beyond semiconductors.
If part of compound semiconductor fab equipment
Specialized compound semiconductor processing machines.
If abrasive coated polishing wheels
Separate classification for interchangeable abrasive tools.
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
• Specify compound semiconductor types and CMP (chemical mechanical polish) slurry compatibility
• Include SSD (subsurface damage) specs
• Avoid general optics polishing classification
Related Products under HTS 8455.30.00.65
Czochralski Crystal Puller Roll
A precision roll used in Czochralski method crystal growers to pull monocrystalline silicon boules for semiconductor wafer production. It falls under HTS 8455.30.00.65 as a roll for rolling mills weighing under 2,268 kg, specifically for processing semiconductor materials into precise diameters. This equipment supports the initial boule formation critical for wafer slicing.
Float Zone Crystal Grower Roll
Specialized roll for float zone method in crystal growers, producing high-purity silicon ingots for semiconductor wafers by precisely controlling zone melting. Classified in HTS 8455.30.00.65 for rolling mill rolls under 2,268 kg used in semiconductor boule processing. Essential for achieving the purity required before wafer slicing and grinding.
Semiconductor Boule Diameter Grinding Roll
Roll designed for crystal grinders that shape semiconductor boules to exact wafer diameters, incorporating flats for conductivity indication. Under HTS 8455.30.00.65 as a rolling mill roll ≤2,268 kg for wafer preparation in semiconductor manufacturing. Critical step before slicing into wafers.
Silicon Wafer Slicing Support Roll
Precision support roll for wafer slicing saws that maintain tension and alignment during boule slicing into thin semiconductor wafers. Fits HTS 8455.30.00.65 for rolling mill rolls under 2,268 kg in semiconductor processing equipment. Ensures uniform wafer thickness for subsequent grinding.
Gallium Arsenide Wafer Lapping Roll
High-precision lapping roll for processing GaAs wafers to exact flatness and dimensional tolerances required for semiconductor fabrication. Classified HTS 8455.30.00.65 as rolling mill roll <2,268 kg per statistical notes for compound semiconductor processing. Prepares surface before fabrication steps.
Monocrystalline Silicon Polishing Roll
Roll for final wafer polishers that achieve mirror-finish flatness on monocrystalline silicon wafers for device fabrication. HTS 8455.30.00.65 covers this <2,268 kg rolling mill roll in semiconductor wafer preparation equipment. Critical for defect-free wafer surfaces.