Not exceeding 2,268 kg
Metal-rolling mills and rolls therefor; parts thereof: > Rolls for rolling mills > Other: > Not exceeding 2,268 kg
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8455.30.00.65
Czochralski Crystal Puller Roll
A precision roll used in Czochralski method crystal growers to pull monocrystalline silicon boules for semiconductor wafer production. It falls under HTS 8455.30.00.65 as a roll for rolling mills weighing under 2,268 kg, specifically for processing semiconductor materials into precise diameters. This equipment supports the initial boule formation critical for wafer slicing.
Float Zone Crystal Grower Roll
Specialized roll for float zone method in crystal growers, producing high-purity silicon ingots for semiconductor wafers by precisely controlling zone melting. Classified in HTS 8455.30.00.65 for rolling mill rolls under 2,268 kg used in semiconductor boule processing. Essential for achieving the purity required before wafer slicing and grinding.
Semiconductor Boule Diameter Grinding Roll
Roll designed for crystal grinders that shape semiconductor boules to exact wafer diameters, incorporating flats for conductivity indication. Under HTS 8455.30.00.65 as a rolling mill roll ≤2,268 kg for wafer preparation in semiconductor manufacturing. Critical step before slicing into wafers.
Silicon Wafer Slicing Support Roll
Precision support roll for wafer slicing saws that maintain tension and alignment during boule slicing into thin semiconductor wafers. Fits HTS 8455.30.00.65 for rolling mill rolls under 2,268 kg in semiconductor processing equipment. Ensures uniform wafer thickness for subsequent grinding.
Gallium Arsenide Wafer Lapping Roll
High-precision lapping roll for processing GaAs wafers to exact flatness and dimensional tolerances required for semiconductor fabrication. Classified HTS 8455.30.00.65 as rolling mill roll <2,268 kg per statistical notes for compound semiconductor processing. Prepares surface before fabrication steps.
Monocrystalline Silicon Polishing Roll
Roll for final wafer polishers that achieve mirror-finish flatness on monocrystalline silicon wafers for device fabrication. HTS 8455.30.00.65 covers this <2,268 kg rolling mill roll in semiconductor wafer preparation equipment. Critical for defect-free wafer surfaces.
Crystal Boule Flat Grinding Roll
Specialized roll for grinding orientation flats on semiconductor crystal boules to indicate resistivity and conductivity type. Under HTS 8455.30.00.65 as ≤2,268 kg roll for rolling mills in wafer manufacturing equipment. Standard industry practice before slicing.
Wafer Edge Profiling Roll
Roll used in wafer grinders to create precise edge profiles on semiconductor wafers for handling and breakage prevention. HTS 8455.30.00.65 for <2,268 kg rolling mill rolls in semiconductor wafer preparation. Meets industry standards for edge strength.
Semiconductor Crystal Ingot Straightening Roll
Roll for straightening semiconductor crystal ingots post-growth to ensure uniform diameter for wafer slicing. Classified in HTS 8455.30.00.65 as rolling mill roll under 2,268 kg for semiconductor material processing. Prevents slicing defects.
Precision Wafer Thickness Control Roll
Roll in wafer grinders that maintains consistent thickness across semiconductor wafers during back-grinding process. HTS 8455.30.00.65 for <2,268 kg rolls in rolling mills for semiconductor wafer preparation equipment. Achieves ±1 micron uniformity.
SOI Wafer Bond Layer Roll
Specialized roll for applying uniform bond layers in Silicon-on-Insulator (SOI) wafer processing equipment. Under HTS 8455.30.00.65 as ≤2,268 kg rolling mill roll for advanced semiconductor wafer manufacturing. Ensures oxide layer consistency.
Compound Semiconductor Polishing Roll
Roll optimized for polishing compound semiconductors like GaN, InP for LED/photonics applications, providing damage-free surfaces. HTS 8455.30.00.65 covers <2,268 kg rolling mill rolls for semiconductor wafer finishing. Handles brittle materials without subsurface damage.
Epitaxial Wafer Carrier Roll
Roll in epitaxial reactor wafer carriers that ensures flat, contamination-free wafer positioning during thin film deposition. Classified HTS 8455.30.00.65 as rolling mill roll <2,268 kg for semiconductor processing. High-temperature resistant for MOCVD/ MBE processes.
Wafer Backside Grinder Roll
Roll specifically for thinning wafer backside to target thickness while preserving frontside device layers in semiconductor packaging. HTS 8455.30.00.65 for <2,268 kg rolls in wafer preparation equipment. Enables 3D stacking and advanced packaging.
Test Wafer Qualification Roll
Roll used in qualification grinders for monitor/test wafers that calibrate semiconductor processing tools. Under HTS 8455.30.00.65 as ≤2,268 kg rolling mill roll for semiconductor wafer processing equipment. Ensures process control standards.