Float Zone Crystal Grower Roll
Specialized roll for float zone method in crystal growers, producing high-purity silicon ingots for semiconductor wafers by precisely controlling zone melting. Classified in HTS 8455.30.00.65 for rolling mill rolls under 2,268 kg used in semiconductor boule processing. Essential for achieving the purity required before wafer slicing and grinding.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If imported as other rolling mill parts beyond rolls
Non-roll components like housings go to parts provision, not specific roll subheading.
If for use in semiconductor wafer grinding machines
Parts for grinding/lapping equipment may classify under metalworking machine tools if not rolling-specific.
If part of complete crystal growth apparatus
Full semiconductor processing machines including rolls classify under dedicated heading per notes.
Not sure which classification is right?
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Import Tips & Compliance
• Include float zone process diagrams in import docs to prove semiconductor material growth application
• Certify exact weight and material compatibility with silicon/gallium arsenide
• Watch for reclassification if bundled with full crystal grower assembly
Related Products under HTS 8455.30.00.65
Czochralski Crystal Puller Roll
A precision roll used in Czochralski method crystal growers to pull monocrystalline silicon boules for semiconductor wafer production. It falls under HTS 8455.30.00.65 as a roll for rolling mills weighing under 2,268 kg, specifically for processing semiconductor materials into precise diameters. This equipment supports the initial boule formation critical for wafer slicing.
Semiconductor Boule Diameter Grinding Roll
Roll designed for crystal grinders that shape semiconductor boules to exact wafer diameters, incorporating flats for conductivity indication. Under HTS 8455.30.00.65 as a rolling mill roll ≤2,268 kg for wafer preparation in semiconductor manufacturing. Critical step before slicing into wafers.
Silicon Wafer Slicing Support Roll
Precision support roll for wafer slicing saws that maintain tension and alignment during boule slicing into thin semiconductor wafers. Fits HTS 8455.30.00.65 for rolling mill rolls under 2,268 kg in semiconductor processing equipment. Ensures uniform wafer thickness for subsequent grinding.
Gallium Arsenide Wafer Lapping Roll
High-precision lapping roll for processing GaAs wafers to exact flatness and dimensional tolerances required for semiconductor fabrication. Classified HTS 8455.30.00.65 as rolling mill roll <2,268 kg per statistical notes for compound semiconductor processing. Prepares surface before fabrication steps.
Monocrystalline Silicon Polishing Roll
Roll for final wafer polishers that achieve mirror-finish flatness on monocrystalline silicon wafers for device fabrication. HTS 8455.30.00.65 covers this <2,268 kg rolling mill roll in semiconductor wafer preparation equipment. Critical for defect-free wafer surfaces.
Crystal Boule Flat Grinding Roll
Specialized roll for grinding orientation flats on semiconductor crystal boules to indicate resistivity and conductivity type. Under HTS 8455.30.00.65 as ≤2,268 kg roll for rolling mills in wafer manufacturing equipment. Standard industry practice before slicing.