Crystal Grinder for Semiconductor Wafers

A precision grinding machine used to grind semiconductor crystal boules to exact diameters and create flats indicating conductivity type and resistivity, as defined in statistical notes for wafer preparation equipment under HTS 8451.80.00.00. This falls under 'other machinery' for processing materials akin to textile finishing due to surface preparation similarities, though primarily for semiconductor boule processing.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳China3.5%+35.0%38.5%
🇲🇽Mexico3.5%+10.0%13.5%
🇨🇦Canada3.5%+10.0%13.5%
🇩🇪Germany3.5%+10.0%13.5%
🇯🇵Japan3.5%+10.0%13.5%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8460.40Lower: 14.4% vs 38.5%

If designed for grinding or polishing semiconductor wafers directly

Chapter 84 note shifts wafer surface processing machines to heading 8460, separate from boule grinders.

9031.49Lower: 10% vs 38.5%

If primarily for testing semiconductor material resistivity

Testing apparatus for semiconductor devices falls under Chapter 90 measuring instruments.

8479.89.65Lower: 20.3% vs 38.5%

If for industrial semiconductor manufacturing machines not fitting specific provisions

Catch-all for unlisted semiconductor manufacturing equipment outside textile-related headings.

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Import Tips & Compliance

Verify equipment qualifies under statistical notes for semiconductor processing to avoid misclassification

Provide detailed technical specs and end-use certificates to customs for duty rate confirmation