Crystal Grinder for Semiconductor Wafers from China
A precision grinding machine used to grind semiconductor crystal boules to exact diameters and create flats indicating conductivity type and resistivity, as defined in statistical notes for wafer preparation equipment under HTS 8451.80.00.00. This falls under 'other machinery' for processing materials akin to textile finishing due to surface preparation similarities, though primarily for semiconductor boule processing.
Duty Rate — China → United States
41%
Rate breakdown
9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Verify equipment qualifies under statistical notes for semiconductor processing to avoid misclassification
• Provide detailed technical specs and end-use certificates to customs for duty rate confirmation