Crystal Grinder for Semiconductor Wafers from Japan
A precision grinding machine used to grind semiconductor crystal boules to exact diameters and create flats indicating conductivity type and resistivity, as defined in statistical notes for wafer preparation equipment under HTS 8451.80.00.00. This falls under 'other machinery' for processing materials akin to textile finishing due to surface preparation similarities, though primarily for semiconductor boule processing.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Verify equipment qualifies under statistical notes for semiconductor processing to avoid misclassification
• Provide detailed technical specs and end-use certificates to customs for duty rate confirmation