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Wafer Flatness Metrology Tool from Mexico

Precision interferometer system measuring wafer bow, warp, and total thickness variation critical for fabrication readiness. HTS 8445.90.00.00 under wafer grinder/lapper/polisher notes.

Duty Rate — Mexico → United States

13.7%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico

Import Tips

Resolution specs (e.g

0.1μm flatness) required

Avoid Chapter 90 if integral to grinding process control

Document feedback loop to lapping equipment