8445.90.00.00/Wafer Flatness Metrology Tool/Mexico

Wafer Flatness Metrology Tool from Mexico

Precision interferometer system measuring wafer bow, warp, and total thickness variation critical for fabrication readiness. HTS 8445.90.00.00 under wafer grinder/lapper/polisher notes.

Duty Rate — Mexico → United States

13.7%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Resolution specs (e.g

• 0.1μm flatness) required

• Avoid Chapter 90 if integral to grinding process control

• Document feedback loop to lapping equipment