Wafer Flatness Metrology Tool from Mexico
Precision interferometer system measuring wafer bow, warp, and total thickness variation critical for fabrication readiness. HTS 8445.90.00.00 under wafer grinder/lapper/polisher notes.
Duty Rate — Mexico → United States
13.7%
Rate breakdown
9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
Import Tips
• Resolution specs (e.g
• 0.1μm flatness) required
• Avoid Chapter 90 if integral to grinding process control
• Document feedback loop to lapping equipment