Wafer Flatness Metrology Tool from Mexico
Precision interferometer system measuring wafer bow, warp, and total thickness variation critical for fabrication readiness. HTS 8445.90.00.00 under wafer grinder/lapper/polisher notes.
Duty Rate — Mexico → United States
13.7%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Resolution specs (e.g
• 0.1μm flatness) required
• Avoid Chapter 90 if integral to grinding process control
• Document feedback loop to lapping equipment