8445.90.00.00/Wafer Flatness Metrology Tool/Japan

Wafer Flatness Metrology Tool from Japan

Precision interferometer system measuring wafer bow, warp, and total thickness variation critical for fabrication readiness. HTS 8445.90.00.00 under wafer grinder/lapper/polisher notes.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Resolution specs (e.g

• 0.1μm flatness) required

• Avoid Chapter 90 if integral to grinding process control

• Document feedback loop to lapping equipment