8445.90.00.00/Wafer Flatness Metrology Tool/Japan

Wafer Flatness Metrology Tool from Japan

Precision interferometer system measuring wafer bow, warp, and total thickness variation critical for fabrication readiness. HTS 8445.90.00.00 under wafer grinder/lapper/polisher notes.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter

Calculate with your customs value Verify with the Tariff Assistant

Import Tips

• Resolution specs (e.g

• 0.1μm flatness) required

• Avoid Chapter 90 if integral to grinding process control

• Document feedback loop to lapping equipment