Semiconductor Wafer Cleaner from Mexico
Automated wet bench station that cleans wafers post-grinding/ lapping using megasonic, brush, and chemical processes to remove particles before fab entry. HTS 8445.90.00.00 as wafer preparation equipment.
Duty Rate — Mexico → United States
13.7%
Rate breakdown
9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
Import Tips
• Include particle removal specs (e.g
• <0.1μm) and chemical compatibility
• Distinguish from fab front-end cleaning (8486)
• Specify single wafer vs batch processing