8445.90.00.00/Semiconductor Wafer Cleaner/Japan

Semiconductor Wafer Cleaner from Japan

Automated wet bench station that cleans wafers post-grinding/ lapping using megasonic, brush, and chemical processes to remove particles before fab entry. HTS 8445.90.00.00 as wafer preparation equipment.

Duty Rate — Japan → United States

13.7%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter

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Import Tips

• Include particle removal specs (e.g

• <0.1μm) and chemical compatibility

• Distinguish from fab front-end cleaning (8486)

• Specify single wafer vs batch processing