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8445.90.00.00/Semiconductor Wafer Cleaner/Japan

Semiconductor Wafer Cleaner from Japan

Automated wet bench station that cleans wafers post-grinding/ lapping using megasonic, brush, and chemical processes to remove particles before fab entry. HTS 8445.90.00.00 as wafer preparation equipment.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Include particle removal specs (e.g

• <0.1μm) and chemical compatibility

• Distinguish from fab front-end cleaning (8486)

• Specify single wafer vs batch processing

Semiconductor Wafer Cleaner from Japan — Import Duty Rate | HTS 8445.90.00.00