Semiconductor Wafer Cleaner from Germany
Automated wet bench station that cleans wafers post-grinding/ lapping using megasonic, brush, and chemical processes to remove particles before fab entry. HTS 8445.90.00.00 as wafer preparation equipment.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Include particle removal specs (e.g
• <0.1μm) and chemical compatibility
• Distinguish from fab front-end cleaning (8486)
• Specify single wafer vs batch processing