Semiconductor Wafer Cleaner from China
Automated wet bench station that cleans wafers post-grinding/ lapping using megasonic, brush, and chemical processes to remove particles before fab entry. HTS 8445.90.00.00 as wafer preparation equipment.
Duty Rate — China → United States
23.7%
Rate breakdown
9903.88.157.5%Except as provided in headings 9903.88.39, 9903.88.42, 9903.88.44, 9903.88.47, 9903.88.49, 9903.88.51, 9903.88.53, 9903.88.55, 9903.88.57, 9903.88.65, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(r) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(s)
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Include particle removal specs (e.g
• <0.1μm) and chemical compatibility
• Distinguish from fab front-end cleaning (8486)
• Specify single wafer vs batch processing