8445.90.00.00/Double-Sided Wafer Polisher/Japan

Double-Sided Wafer Polisher from Japan

Chemical mechanical polishing (CMP) equipment that polishes both wafer surfaces simultaneously using polishing pads and slurry for mirror finish required in device fabrication. Classified HTS 8445.90.00.00 under statistical note for wafer polishers.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Include polishing pad pressure and slurry flow specifications

• Classify as prep equipment only if pre-fab polishing confirmed