8445.90.00.00/Double-Sided Wafer Polisher/Japan

Double-Sided Wafer Polisher from Japan

Chemical mechanical polishing (CMP) equipment that polishes both wafer surfaces simultaneously using polishing pads and slurry for mirror finish required in device fabrication. Classified HTS 8445.90.00.00 under statistical note for wafer polishers.

Duty Rate — Japan → United States

13.7%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter

Calculate with your customs value Verify classification with AI

Import Tips

• Include polishing pad pressure and slurry flow specifications

• Classify as prep equipment only if pre-fab polishing confirmed