</>Build with Tariff Intelligence|Programmatic access to tariff calculations and HS code classification.Explore Developer Resources →
8445.90.00.00/Double-Sided Wafer Polisher/Germany

Double-Sided Wafer Polisher from Germany

Chemical mechanical polishing (CMP) equipment that polishes both wafer surfaces simultaneously using polishing pads and slurry for mirror finish required in device fabrication. Classified HTS 8445.90.00.00 under statistical note for wafer polishers.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Calculate with your customs valueVerify classification with AI

Import Tips

• Include polishing pad pressure and slurry flow specifications

• Classify as prep equipment only if pre-fab polishing confirmed