Double-Sided Wafer Polisher from Germany
Chemical mechanical polishing (CMP) equipment that polishes both wafer surfaces simultaneously using polishing pads and slurry for mirror finish required in device fabrication. Classified HTS 8445.90.00.00 under statistical note for wafer polishers.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include polishing pad pressure and slurry flow specifications
• Classify as prep equipment only if pre-fab polishing confirmed