</>Build with Tariff Intelligence|Programmatic access to tariff calculations and HS code classification.Explore Developer Resources →
8445.90.00.00/Double-Sided Wafer Polisher/China

Double-Sided Wafer Polisher from China

Chemical mechanical polishing (CMP) equipment that polishes both wafer surfaces simultaneously using polishing pads and slurry for mirror finish required in device fabrication. Classified HTS 8445.90.00.00 under statistical note for wafer polishers.

Duty Rate — China → United States

23.7%

Rate breakdown

9903.88.157.5%Except as provided in headings 9903.88.39, 9903.88.42, 9903.88.44, 9903.88.47, 9903.88.49, 9903.88.51, 9903.88.53, 9903.88.55, 9903.88.57, 9903.88.65, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(r) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(s)
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Calculate with your customs valueVerify classification with AI

Import Tips

• Include polishing pad pressure and slurry flow specifications

• Classify as prep equipment only if pre-fab polishing confirmed

Double-Sided Wafer Polisher from China — Import Duty Rate | HTS 8445.90.00.00