Double-Sided Wafer Polisher from China
Chemical mechanical polishing (CMP) equipment that polishes both wafer surfaces simultaneously using polishing pads and slurry for mirror finish required in device fabrication. Classified HTS 8445.90.00.00 under statistical note for wafer polishers.
Duty Rate — China → United States
23.7%
Rate breakdown
9903.05.3112.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of China, as provided for in U.S. note 52 to this subchapter
9903.88.157.5%Except as provided in headings 9903.88.39, 9903.88.42, 9903.88.44, 9903.88.47, 9903.88.49, 9903.88.51, 9903.88.53, 9903.88.55, 9903.88.57, 9903.88.65, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(r) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(s)
Import Tips
• Include polishing pad pressure and slurry flow specifications
• Classify as prep equipment only if pre-fab polishing confirmed