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8445.90.00.00/Double-Sided Wafer Polisher/Canada

Double-Sided Wafer Polisher from Canada

Chemical mechanical polishing (CMP) equipment that polishes both wafer surfaces simultaneously using polishing pads and slurry for mirror finish required in device fabrication. Classified HTS 8445.90.00.00 under statistical note for wafer polishers.

Duty Rate — Canada → United States

13.7%

Rate breakdown

9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
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Import Tips

• Include polishing pad pressure and slurry flow specifications

• Classify as prep equipment only if pre-fab polishing confirmed