Wafer Polishing Slurry Feed Nozzle from Mexico
Sapphire or ceramic nozzle assembly that precisely delivers polishing slurry to wafer surfaces during CMP preparation. Controls flow rate for uniform material removal. Part of wafer polishing equipment under 8442.40.00.00.
Duty Rate — Mexico → United States
10%
Rate breakdown
9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
Import Tips
• Specify orifice diameter (0.2-0.5mm) and material compatibility (silica/ceria slurries)
• Include wear rate data; nozzles >500 hours life classify as durable parts
• Bundle only with matching polishers; separate import prevents set classification