Wafer Polishing Slurry Feed Nozzle from Japan
Sapphire or ceramic nozzle assembly that precisely delivers polishing slurry to wafer surfaces during CMP preparation. Controls flow rate for uniform material removal. Part of wafer polishing equipment under 8442.40.00.00.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify orifice diameter (0.2-0.5mm) and material compatibility (silica/ceria slurries)
• Include wear rate data; nozzles >500 hours life classify as durable parts
• Bundle only with matching polishers; separate import prevents set classification