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8442.30.01/Chemical Mechanical Wafer Polisher/Japan

Chemical Mechanical Wafer Polisher from Japan

CMP polishers use chemical slurries and polishing pads to achieve mirror-finish semiconductor wafer surfaces for lithography. Falls under HTS 8442.30.01 as equipment for final printing component preparation.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Include slurry flow rate and pad pressure specs for classification

• Declare chemical handling systems separately if modular