Chemical Mechanical Wafer Polisher from Japan
CMP polishers use chemical slurries and polishing pads to achieve mirror-finish semiconductor wafer surfaces for lithography. Falls under HTS 8442.30.01 as equipment for final printing component preparation.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include slurry flow rate and pad pressure specs for classification
• Declare chemical handling systems separately if modular