Wafer Polishing Head with Pad Holder from Mexico
Carrier head with kinematic mounting for chemical mechanical planarization (CMP) pads used in final wafer polishing to angstrom-level flatness. For wafer polishers of heading 8430 semiconductor equipment. 8431.49.90 other parts.
Duty Rate — Mexico → United States
25%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles of aluminum, of steel or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; patented pharmaceutical articles; and semiconductor articles, as provided in subdivision (f) of U.S. note 52 to this subchapter
Import Tips
• Document CMP slurry compatibility and removal rate specs
• Common issue: classifying under 8421.19 as countertype centrifuges
• Requires cleanroom validation data