Wafer Polishing Head with Pad Holder from Germany
Carrier head with kinematic mounting for chemical mechanical planarization (CMP) pads used in final wafer polishing to angstrom-level flatness. For wafer polishers of heading 8430 semiconductor equipment. 8431.49.90 other parts.
Duty Rate — Germany → United States
15%
Rate breakdown
9903.82.2215%Section 232: derivative steel (c)(xi), product of AR/EC/SV/GT/JP/KR/LI/CH/TW/GB/EU — 15%
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Document CMP slurry compatibility and removal rate specs
• Common issue: classifying under 8421.19 as countertype centrifuges
• Requires cleanroom validation data