Wafer Polishing Head with Pad Holder from Germany
Carrier head with kinematic mounting for chemical mechanical planarization (CMP) pads used in final wafer polishing to angstrom-level flatness. For wafer polishers of heading 8430 semiconductor equipment. 8431.49.90 other parts.
Duty Rate — Germany → United States
15%
Rate breakdown
9903.82.2215%Derivative steel articles the product of Argentina, Ecuador, El Salvador, Guatemala, Japan, the Republic of Korea, Liechtenstein, Switzerland, Taiwan, the United Kingdom, or a member nation of the European Union, as provided for in subdivision (c)(xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Document CMP slurry compatibility and removal rate specs
• Common issue: classifying under 8421.19 as countertype centrifuges
• Requires cleanroom validation data