Wafer Polishing Head Vacuum Chuck from Japan
Porous ceramic vacuum chuck that mounts on polishing heads of wafer polishers (8429) to hold semiconductor wafers flat during final CMP preparation for device fabrication. Critical for nanometer flatness. 8431.49.9020.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify porosity (10-40%), vacuum level, and wafer size compatibility
• Provide SEM photos of porous structure for material verification
• Solid chucks without vacuum classify differently under 6909