Wafer Polishing Head Vacuum Chuck from Germany
Porous ceramic vacuum chuck that mounts on polishing heads of wafer polishers (8429) to hold semiconductor wafers flat during final CMP preparation for device fabrication. Critical for nanometer flatness. 8431.49.9020.
Duty Rate — Germany → United States
15%
Rate breakdown
9903.82.2215%Derivative steel articles the product of Argentina, Ecuador, El Salvador, Guatemala, Japan, the Republic of Korea, Liechtenstein, Switzerland, Taiwan, the United Kingdom, or a member nation of the European Union, as provided for in subdivision (c)(xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Specify porosity (10-40%), vacuum level, and wafer size compatibility
• Provide SEM photos of porous structure for material verification
• Solid chucks without vacuum classify differently under 6909