Wafer Polishing Head Vacuum Chuck from Germany
Porous ceramic vacuum chuck that mounts on polishing heads of wafer polishers (8429) to hold semiconductor wafers flat during final CMP preparation for device fabrication. Critical for nanometer flatness. 8431.49.9020.
Duty Rate — Germany → United States
15%
Rate breakdown
9903.82.2215%Section 232: derivative steel (c)(xi), product of AR/EC/SV/GT/JP/KR/LI/CH/TW/GB/EU — 15%
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Specify porosity (10-40%), vacuum level, and wafer size compatibility
• Provide SEM photos of porous structure for material verification
• Solid chucks without vacuum classify differently under 6909