Wafer Polishing Head Vacuum Chuck from Canada
Porous ceramic vacuum chuck that mounts on polishing heads of wafer polishers (8429) to hold semiconductor wafers flat during final CMP preparation for device fabrication. Critical for nanometer flatness. 8431.49.9020.
Duty Rate — Canada → United States
25%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Specify porosity (10-40%), vacuum level, and wafer size compatibility
• Provide SEM photos of porous structure for material verification
• Solid chucks without vacuum classify differently under 6909