Double-Sided Wafer Polisher from Canada
Equipment polishing both sides of semiconductor wafers simultaneously using chemical-mechanical planarization (CMP) pads. Fits HTS 8431.39.0080 as other parts of heading 8428 polishers for wafer prep. Achieves mirror finish for device fabrication.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Include CMP slurry flow data and pad pressure specs for customs review
• Avoid misclass as consumer polishers (8439)
• Validate cleanroom class 1 compatibility