CMP Polishing Pad Conditioner from Japan
Diamond disk conditioner that dresses CMP pads between wafer polishing runs. HTS 8431.39.0080 as part for 8428 wafer polishers. Maintains pad planarity for consistent removal rates.
Duty Rate — Japan → United States
15%
Rate breakdown
9903.82.1015%Except as provided for in headings 9903.82.12, 9903.82.17 and 9903.85.68, derivative aluminum and steel articles with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 15 percent, as provided for in subdivision (f) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Include diamond grit size (70-120 micron) and dresser pattern specs
• Pitfall: abrasives under 6804
• Track pad life data for valuation