Silicon Wafer Lapping Plate from Germany
Cast iron or ceramic plate used in lapping machines to achieve flatness tolerances on semiconductor wafers post-slicing. Part for 8425 wafer preparation apparatus, in 8431.10.0090. Critical for bringing wafers within nanometer-level planarity before polishing.
Duty Rate — Germany → United States
15%
Rate breakdown
9903.94.5315%Parts of passenger vehicles and light trucks that are products of the European Union as specified in subdivision (o) of U.S. note 33 to this subchapter, with an ad valorem (or ad valorem equivalent as provided for in subdivision (m) of U.S. note 33 to this subchapter) rate of duty under column1 less than 15 percent.
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
9903.74.110%Articles as provided for in subdivision (l) of U.S. note 38 to this subchapter.
Import Tips
• Document lapping slurry compatibility and flatness specs (<1 micron); avoid general abrasive plate classification
• Use CBP ruling requests for custom plates