Silicon Wafer Lapping Plate from Germany
Cast iron or ceramic plate used in lapping machines to achieve flatness tolerances on semiconductor wafers post-slicing. Part for 8425 wafer preparation apparatus, in 8431.10.0090. Critical for bringing wafers within nanometer-level planarity before polishing.
Duty Rate — Germany → United States
15%
Rate breakdown
9903.94.5315%Parts of passenger vehicles and light trucks that are products of the European Union as specified in subdivision (o) of U.S. note 33 to this subchapter, with an ad valorem (or ad valorem equivalent as provided for in subdivision (m) of U.S. note 33 to this subchapter) rate of duty under column1 less than 15 percent.
9903.74.110%Articles as provided for in subdivision (l) of U.S. note 38 to this subchapter.
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Document lapping slurry compatibility and flatness specs (<1 micron); avoid general abrasive plate classification
• Use CBP ruling requests for custom plates