Semiconductor Crystal Boule Grinder from Germany
Precision grinder for shaping crystal boules to exact wafer diameters and flats indicating conductivity type. A key part of wafer preparation equipment under 8425, classified in 8431.10.0090 'Other'. Used post-growth to prepare for slicing in semiconductor fabrication.
Duty Rate — Germany → United States
15%
Rate breakdown
9903.94.5315%Parts of passenger vehicles and light trucks that are products of the European Union as specified in subdivision (o) of U.S. note 33 to this subchapter, with an ad valorem (or ad valorem equivalent as provided for in subdivision (m) of U.S. note 33 to this subchapter) rate of duty under column1 less than 15 percent.
9903.74.110%Articles as provided for in subdivision (l) of U.S. note 38 to this subchapter.
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Provide evidence of resistivity flat grinding function; ensure tolerances match semiconductor specs
• Avoid pitfall of classifying as general metalworking grinder under 8460