Czochralski Crystal Puller Nozzle Assembly

This nozzle assembly is a precision-engineered part used in Czochralski crystal growers for directing the flow of molten silicon during monocrystalline boule formation in semiconductor manufacturing. It falls under HTS 8424.90.9080 as a part of a mechanical appliance for projecting liquids (molten semiconductor material). Classified here due to its role in jet projecting high-temperature liquids in crystal growth equipment.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳ChinaFree+35.0%35%
🇲🇽MexicoFree+10.0%10%
🇨🇦CanadaFree+10.0%10%
🇩🇪GermanyFree+10.0%10%
🇯🇵JapanFree+10.0%10%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8487.90.00Higher: 38.9% vs 35%

If considered machinery part not specific to projecting

Parts of industrial machinery not fitting Chapter 84 spray/projecting categories default to 8487 as other machinery parts.

9031.90Lower: 10% vs 35%

If for semiconductor testing equipment integration

If primarily for wafer testing apparatus rather than crystal growth, falls under Chapter 90 measuring/testing instruments.

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Import Tips & Compliance

Obtain manufacturer's declaration confirming use in semiconductor crystal growth to support classification; ensure documentation specifies material compatibility with molten silicon; watch for reclassification if sold as complete grower unit

Related Products under HTS 8424.90.90.80

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A specialized coolant nozzle for wafer slicing saws that disperses liquid coolant precisely onto diamond blades during semiconductor wafer cutting from crystal boules. Classified under HTS 8424.90.9080 as a part for mechanical appliances dispersing liquids in semiconductor processing equipment. Ensures precise wafer slicing without thermal damage.

Crystal Grinder Slurry Spray Head

This spray head disperses abrasive slurry onto crystal boules during grinding to achieve precise wafer diameters in semiconductor wafer preparation. It qualifies under HTS 8424.90.9080 as a part for projecting powders/liquids in mechanical grinding appliances for semiconductor processing. Critical for flat and diameter accuracy.

Wafer Lapping Machine Coolant Dispenser

Precision dispenser part for lapping machines that projects coolant onto semiconductor wafers to maintain flatness during surface preparation. Falls under HTS 8424.90.9080 as a mechanical part for dispersing liquids in wafer processing equipment. Essential for achieving required wafer tolerances.

Float Zone Crystal Furnace Gas Injector

Injector nozzle for float zone crystal growers that disperses inert gases to stabilize the molten zone during monocrystalline semiconductor production. Classified in HTS 8424.90.9080 as a part for jet projecting gases/powders in crystal pulling machines. Key for defect-free boule growth.

Wafer Polisher Slurry Nozzle Array

Array of nozzles that evenly distribute polishing slurry across semiconductor wafers for mirror-finish surface preparation before fabrication. Under HTS 8424.90.9080 as parts dispersing liquid powders in wafer polishing appliances. Ensures optimal wafer flatness for device processing.

Semiconductor Spray Cleaning Gun Head

Replaceable head for spray guns used in cleaning semiconductor wafers between processing steps, dispersing deionized water or chemicals. Fits HTS 8424.90.9080 as a part of spray guns for semiconductor manufacturing. Removes contaminants without surface damage.