Other
Mechanical appliances (whether or not hand operated) for projecting, dispersing or spraying liquids or powders; fire extinguishers, whether or not charged; spray guns and similar appliances; steam or sand blasting machines and similar jet projecting machines; parts thereof: > Parts: > Other > Other
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
Products classified under HTS 8424.90.90.80
Czochralski Crystal Puller Nozzle Assembly
This nozzle assembly is a precision-engineered part used in Czochralski crystal growers for directing the flow of molten silicon during monocrystalline boule formation in semiconductor manufacturing. It falls under HTS 8424.90.9080 as a part of a mechanical appliance for projecting liquids (molten semiconductor material). Classified here due to its role in jet projecting high-temperature liquids in crystal growth equipment.
Wafer Slicing Saw Coolant Nozzle
A specialized coolant nozzle for wafer slicing saws that disperses liquid coolant precisely onto diamond blades during semiconductor wafer cutting from crystal boules. Classified under HTS 8424.90.9080 as a part for mechanical appliances dispersing liquids in semiconductor processing equipment. Ensures precise wafer slicing without thermal damage.
Crystal Grinder Slurry Spray Head
This spray head disperses abrasive slurry onto crystal boules during grinding to achieve precise wafer diameters in semiconductor wafer preparation. It qualifies under HTS 8424.90.9080 as a part for projecting powders/liquids in mechanical grinding appliances for semiconductor processing. Critical for flat and diameter accuracy.
Wafer Lapping Machine Coolant Dispenser
Precision dispenser part for lapping machines that projects coolant onto semiconductor wafers to maintain flatness during surface preparation. Falls under HTS 8424.90.9080 as a mechanical part for dispersing liquids in wafer processing equipment. Essential for achieving required wafer tolerances.
Float Zone Crystal Furnace Gas Injector
Injector nozzle for float zone crystal growers that disperses inert gases to stabilize the molten zone during monocrystalline semiconductor production. Classified in HTS 8424.90.9080 as a part for jet projecting gases/powders in crystal pulling machines. Key for defect-free boule growth.
Wafer Polisher Slurry Nozzle Array
Array of nozzles that evenly distribute polishing slurry across semiconductor wafers for mirror-finish surface preparation before fabrication. Under HTS 8424.90.9080 as parts dispersing liquid powders in wafer polishing appliances. Ensures optimal wafer flatness for device processing.
Semiconductor Spray Cleaning Gun Head
Replaceable head for spray guns used in cleaning semiconductor wafers between processing steps, dispersing deionized water or chemicals. Fits HTS 8424.90.9080 as a part of spray guns for semiconductor manufacturing. Removes contaminants without surface damage.
Crystal Boule Sandblasting Nozzle
Specialized nozzle for sandblasting machines that projects abrasive powder onto semiconductor crystal boules to prepare surfaces before slicing. HTS 8424.90.9080 covers such parts for powder jet projecting in wafer manufacturing equipment. Achieves uniform surface for precise sawing.