Czochralski Crystal Puller
A specialized centrifuge apparatus used in semiconductor manufacturing to grow monocrystalline silicon boules by pulling crystals from molten silicon via the Czochralski method. It falls under HTS 8421.39.0115 as dust collection and air purification equipment because it incorporates integrated filtering systems to remove impurities and particulates from the inert gas atmosphere during crystal growth. This ensures ultra-clean conditions essential for high-purity semiconductor production.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| π¨π³China | Free | +35.0% | 35% |
| π²π½Mexico | Free | +10.0% | 10% |
| π¨π¦Canada | Free | +10.0% | 10% |
| π©πͺGermany | Free | +10.0% | 10% |
| π―π΅Japan | Free | +10.0% | 10% |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If primarily classified as thermal processing equipment without integrated filters
Machines for semiconductor thermal treatment fall under heading 8486 if purification features are secondary.
If for inline gas purity testing during operation
If equipped with integrated analyzers for physical/chemical testing of purified gases, it shifts to Chapter 90.
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Import Tips & Compliance
β’ Verify equipment includes certified HEPA or ULPA filters for gas purification to qualify under this subheading; provide manufacturer specs
β’ Include end-use documentation proving semiconductor manufacturing application to avoid reclassification
Related Products under HTS 8421.39.01.15
300mm Silicon Wafer Prep Dust Extraction Hood
Localized dust collection hood for 300mm wafer preparation lines including slicing, grinding, and polishing stations, filtering process-generated airborne particles. HTS 8421.39.0115 for semiconductor wafer manufacturing air purification equipment. Supports high-volume production of logic/memory wafers.
Float Zone Crystal Grower
Centrifugal apparatus employing the float zone method to purify and grow semiconductor crystals like silicon by melting and recrystallizing zones in a controlled inert gas environment with dust filtration. Classified under HTS 8421.39.0115 due to its built-in air purification systems that filter out particulates to prevent contamination during high-vacuum zone refining. Critical for producing ultra-pure silicon ingots for wafer slicing.
Semiconductor Wafer Crystal Grinder Dust Collector
Integrated filtering and purification system attached to crystal grinders used to shape semiconductor boules to precise diameters, collecting diamond slurry and silicon dust particles from the air stream. Falls under HTS 8421.39.0115 as specialized dust collection equipment for maintaining clean air in wafer preparation environments. Essential for preventing airborne contaminants from affecting subsequent wafer processing.
Gallium Arsenide Crystal Puller Gas Purifier
Purification apparatus for inert gas lines in GaAs crystal growth centrifuges, removing moisture, oxygen, and particulates to achieve ppb-level purity required for compound semiconductor production. HTS 8421.39.0115 classification applies due to its role in dust collection and air cleaning specific to semiconductor boule formation equipment. Prevents defects in high-value GaAs wafers used in RF and optoelectronics.
Wafer Slicing Saw Air Filtration Unit
Dust collection and mist filtration system for inner diameter saws that slice semiconductor wafers from crystal boules, capturing silicon particles and coolant aerosols from the cutting process. Under HTS 8421.39.0115 as air purification equipment integral to wafer preparation machinery in semiconductor fabs. Maintains ISO Class 1 cleanroom standards during high-volume wafer production.
Silicon Wafer Lapping Machine Exhaust Purifier
Gas and particulate filtration unit for exhaust from wafer lapping equipment that grinds wafers to precise thickness tolerances, removing abrasive slurry mists and silicon fines. Classified in HTS 8421.39.0115 for its dust collection role in semiconductor wafer preparation processes as per statistical notes. Critical for downstream flatness polishing and device fabrication.