Machines and apparatus for the manufacture of semiconductor devices or of electronic integrated circuits
Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in note 11(C) to this chapter; parts and accessories: > Machines and apparatus for the manufacture of semiconductor devices or of electronic integrated circuits
Duty Rate (from China)
Except as provided in headings 9903.88.12, 9903.88.17, 9903.88.20, 9903.88.54, 9903.88.59, 9903.88.61, 9903.88.63, 9903.88.66, 9903.88.67, 9903.88.68, 9903.88.69, or 9903.88.70, articles the product of China, as provided for in U.S. note 20(c) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(d)
Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
Products classified under HTS 8486.20.00.00
Czochralski Crystal Puller
A Czochralski crystal puller is used to produce extremely pure monocrystalline silicon boules from which semiconductor wafers are sliced, essential for semiconductor device manufacturing. It falls under HTS 8486.20.00.00 as apparatus specifically for the manufacture of semiconductor devices. This machine employs the Czochralski method to grow high-purity crystals used in integrated circuits.
Float Zone Crystal Grower
Float zone crystal growers produce monocrystalline semiconductor boules using the float zone method, ideal for high-purity silicon wafers in electronic integrated circuits. Classified under HTS 8486.20.00.00 for its principal role in semiconductor device manufacture. This apparatus minimizes impurities crucial for advanced IC fabrication.
Semiconductor Wafer Slicing Saw
Wafer slicing saws precisely cut monocrystalline semiconductor boules into thin wafers for device fabrication, using diamond wire or blades. This apparatus is classified under HTS 8486.20.00.00 as essential for semiconductor manufacturing processes. It ensures minimal material loss and precise wafer thickness for IC production.
Crystal Boule Grinder
Crystal boule grinders shape semiconductor boules to precise diameters and grind flats indicating conductivity type and resistivity, preparing for wafer slicing. Falls under HTS 8486.20.00.00 for semiconductor boule manufacturing apparatus. Critical for achieving uniform wafers used in device fabrication.
Wafer Lapping Machine
Wafer lapping machines grind and polish semiconductor wafers to precise flatness and thickness tolerances required before fabrication processes. Classified in HTS 8486.20.00.00 as apparatus for semiconductor device manufacture per statistical notes. Ensures surface planarity critical for photolithography.
Chemical Mechanical Wafer Polisher
CMP (Chemical Mechanical Polishing) tools polish semiconductor wafers to atomic-level flatness using slurry and pads, vital for IC layer planarization. Under HTS 8486.20.00.00 for semiconductor device manufacturing apparatus. Removes material uniformly for multi-layer device stacking.
Wafer Edge Grinding Machine
Specialized grinders profile semiconductor wafer edges to prevent chipping and ensure handling safety during fabrication. Classified HTS 8486.20.00.00 as wafer preparation equipment for device manufacture. Achieves precise edge geometry for automated processing.
Silicon Wafer Cleaning Station
Automated cleaning stations remove particles and contaminants from semiconductor wafers using megasonic, brush, or chemical methods before processing. Falls under HTS 8486.20.00.00 for semiconductor manufacturing apparatus. Critical for yield in device fabrication.
Photolithography Wafer Stepper
Wafer steppers expose circuit patterns onto photoresist-coated semiconductor wafers using projection optics in IC fabrication. HTS 8486.20.00.00 classification for semiconductor device manufacturing machines. Enables micron-scale feature definition.
Plasma Etching Reactor
Plasma etching reactors anisotropically remove material from semiconductor wafers using reactive ion etching for circuit definition. Under HTS 8486.20.00.00 as core semiconductor device processing apparatus. Provides precise pattern transfer.
Ion Implantation System
High-energy ion implanters dope semiconductor wafers with precise impurity concentrations for transistor formation in ICs. Classified HTS 8486.20.00.00 for semiconductor device manufacture. Controls dopant depth/profile accurately.
Chemical Vapor Deposition Furnace
CVD furnaces deposit thin films of insulators, metals, or semiconductors onto wafers via gas-phase reactions for IC layers. HTS 8486.20.00.00 for semiconductor processing apparatus. Enables conformal coatings.
Wafer Annealing Oven
Rapid thermal annealing ovens activate dopants and repair lattice damage in semiconductor wafers post-implantation. Under HTS 8486.20.00.00 as semiconductor manufacturing apparatus. Provides precise temperature ramps.
Semiconductor Wafer Metrology Tool
In-line metrology tools measure wafer thickness, overlay, and critical dimensions during device manufacturing for process control. Borderline HTS 8486.20.00.00 if integral to fabrication. Distinguish from pure testing in Chapter 90.
Dielectric Film Sputtering System
Sputter deposition systems apply dielectric and metal thin films to semiconductor wafers using plasma sputtering targets. HTS 8486.20.00.00 for IC manufacturing apparatus. Provides pinhole-free films.