Photolithography Wafer Stepper
Wafer steppers expose circuit patterns onto photoresist-coated semiconductor wafers using projection optics in IC fabrication. HTS 8486.20.00.00 classification for semiconductor device manufacturing machines. Enables micron-scale feature definition.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If general projection lenses only
Optical elements alone are Chapter 90, not complete manufacturing machines.
If other automatic data processing machines
If control system dominates, may shift to data processing equipment.
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Import Tips & Compliance
• Document resolution specs (e.g
• <10nm); comply with light source export controls; provide alignment system details
Related Products under HTS 8486.20.00.00
Czochralski Crystal Puller
A Czochralski crystal puller is used to produce extremely pure monocrystalline silicon boules from which semiconductor wafers are sliced, essential for semiconductor device manufacturing. It falls under HTS 8486.20.00.00 as apparatus specifically for the manufacture of semiconductor devices. This machine employs the Czochralski method to grow high-purity crystals used in integrated circuits.
Float Zone Crystal Grower
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Semiconductor Wafer Slicing Saw
Wafer slicing saws precisely cut monocrystalline semiconductor boules into thin wafers for device fabrication, using diamond wire or blades. This apparatus is classified under HTS 8486.20.00.00 as essential for semiconductor manufacturing processes. It ensures minimal material loss and precise wafer thickness for IC production.
Crystal Boule Grinder
Crystal boule grinders shape semiconductor boules to precise diameters and grind flats indicating conductivity type and resistivity, preparing for wafer slicing. Falls under HTS 8486.20.00.00 for semiconductor boule manufacturing apparatus. Critical for achieving uniform wafers used in device fabrication.
Wafer Lapping Machine
Wafer lapping machines grind and polish semiconductor wafers to precise flatness and thickness tolerances required before fabrication processes. Classified in HTS 8486.20.00.00 as apparatus for semiconductor device manufacture per statistical notes. Ensures surface planarity critical for photolithography.
Chemical Mechanical Wafer Polisher
CMP (Chemical Mechanical Polishing) tools polish semiconductor wafers to atomic-level flatness using slurry and pads, vital for IC layer planarization. Under HTS 8486.20.00.00 for semiconductor device manufacturing apparatus. Removes material uniformly for multi-layer device stacking.