Wafer Edge Profiling Machine from Japan
Equipment for profiling wafer edges to remove micro-cracks and control edge geometry, using grinding with temperature-controlled coolant. Prevents chipping during handling. Under 8419.90.50.80 for wafer preparation parts.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify edge profiles (e.g
• shark-fin vs. butt); declare chip-out specs; comply with SEMI standards