8419.90.50.80/Wafer Edge Profiling Machine/Japan

Wafer Edge Profiling Machine from Japan

Equipment for profiling wafer edges to remove micro-cracks and control edge geometry, using grinding with temperature-controlled coolant. Prevents chipping during handling. Under 8419.90.50.80 for wafer preparation parts.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Specify edge profiles (e.g

• shark-fin vs. butt); declare chip-out specs; comply with SEMI standards