Other
Machinery, plant or laboratory equipment, whether or not electrically heated (excluding furnaces, ovens and other equipment of heading 8514), for the treatment of materials by a process involving a change of temperature such as heating, cooking, roasting, distilling, rectifying, sterilizing, pasteurizing, steaming, drying, evaporating, vaporizing, condensing or cooling, other than machinery or plant of a kind used for domestic purposes; instantaneous or storage water heaters, nonelectric; parts thereof: > Parts: > Other: > Of molten-salt-cooled acrylic acid reactors; of medical, surgical or laboratory sterilizers > Other
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8419.90.50.80
Silicon Wafer Crystal Puller
A Czochralski method crystal puller used to grow monocrystalline silicon boules from molten silicon for semiconductor wafer production. It controls temperature precisely to pull high-purity crystals, involving heating and controlled cooling processes. Classified under 8419.90.50.80 as a part for semiconductor manufacturing equipment involving temperature change for material treatment.
Float Zone Silicon Crystal Grower
Float zone furnace apparatus for producing ultra-pure silicon crystals by zone melting, heating a narrow zone of polycrystalline silicon rod to melt and recrystallize. Used in semiconductor industry for high-resistivity wafers. Falls under 8419.90.50.80 for parts of temperature-treatment equipment in semiconductor processing.
Crystal Boule Grinder
Precision grinder for shaping semiconductor crystal boules to exact diameter and flats indicating conductivity type. Generates controlled heat during grinding for material treatment. Part of wafer prep equipment under 8419.90.50.80 for temperature-involved semiconductor processing.
Wafer Slicing Diamond Saw
High-precision inner-diameter saw with diamond blade for slicing monocrystalline boules into thin semiconductor wafers. Coolant systems manage heat from cutting process. Classified in 8419.90.50.80 as part for wafer manufacturing temperature treatment.
Semiconductor Wafer Lapper
Lapping machine that uses abrasive slurries to flatten semiconductor wafers to optical tolerances, controlling slurry temperature for uniform material removal. Critical for wafer flatness before polishing. Under 8419.90.50.80 for semiconductor wafer prep equipment.
Double-Sided Wafer Polisher
Chemical-mechanical planarization (CMP) polisher for simultaneous double-sided polishing of silicon wafers, maintaining precise temperature control of polishing pads and slurries. Prepares wafer surface for device fabrication. Fits 8419.90.50.80 as semiconductor processing part.
GaAs Wafer Grinder
Backside grinder for gallium arsenide (GaAs) wafers, using controlled grinding wheels and coolant to thin wafers while managing heat to prevent cracking. Used after epi-layer growth. Part under 8419.90.50.80 for compound semiconductor processing.
Crystal Ingot Annealer
Thermal annealing furnace part for semiconductor crystal ingots, relieving stresses through controlled heating and slow cooling cycles post-growth. Essential for defect reduction. Classified 8419.90.50.80 for temperature treatment in semiconductor manufacturing.
Wafer Edge Profiling Machine
Equipment for profiling wafer edges to remove micro-cracks and control edge geometry, using grinding with temperature-controlled coolant. Prevents chipping during handling. Under 8419.90.50.80 for wafer preparation parts.
Silicon Boule Flattener
Machine for grinding flats on silicon boules to denote crystal orientation and doping type, with precise temperature management during surface generation. Part of wafer prep sequence. Fits 8419.90.50.80 classification.