Wafer Edge Profiling Machine from Germany
Equipment for profiling wafer edges to remove micro-cracks and control edge geometry, using grinding with temperature-controlled coolant. Prevents chipping during handling. Under 8419.90.50.80 for wafer preparation parts.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify edge profiles (e.g
• shark-fin vs. butt); declare chip-out specs; comply with SEMI standards