Gallium Arsenide Wafer Grinder from Mexico
Specialized grinder for back-thinning GaAs compound semiconductor wafers to device fabrication thicknesses with integrated cooling systems. Specifically HTS 8419.89.95.85 for 'other materials' (non-silicon) wafer preparation equipment.
Duty Rate — Mexico → United States
14.2%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Explicitly declare GaAs/compound semiconductor use to qualify for 'other materials' subheading
• Include material safety data for gallium compounds in shipping docs
• Silicon versions use 8419.89.9580; ensure material specificity prevents misclassification