For other materials
Machinery, plant or laboratory equipment, whether or not electrically heated (excluding furnaces, ovens and other equipment of heading 8514), for the treatment of materials by a process involving a change of temperature such as heating, cooking, roasting, distilling, rectifying, sterilizing, pasteurizing, steaming, drying, evaporating, vaporizing, condensing or cooling, other than machinery or plant of a kind used for domestic purposes; instantaneous or storage water heaters, nonelectric; parts thereof: > Other machinery, plant or equipment: > Other: > Other: > Other > Other: > For other materials
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.12, 9903.88.17, 9903.88.20, 9903.88.54, 9903.88.59, 9903.88.61, 9903.88.63, 9903.88.66, 9903.88.67, 9903.88.68, 9903.88.69, or 9903.88.70, articles the product of China, as provided for in U.S. note 20(c) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(d)
Products classified under HTS 8419.89.95.85
Float Zone Crystal Grower
Equipment employing the float zone method to produce high-purity monocrystalline semiconductor boules through localized melting and resolidification zones. Classified under HTS 8419.89.95.85 for its heating and cooling processes on 'other materials' like silicon or gallium arsenide in semiconductor production.
Wafer Lapping Machine
Equipment that lap semiconductor wafers to achieve precise flatness and thickness uniformity using abrasive slurries and temperature-controlled platens. Classified in HTS 8419.89.95.85 for wafer preparation involving material treatment by temperature change on other semiconductor materials.
Gallium Arsenide Wafer Grinder
Specialized grinder for back-thinning GaAs compound semiconductor wafers to device fabrication thicknesses with integrated cooling systems. Specifically HTS 8419.89.95.85 for 'other materials' (non-silicon) wafer preparation equipment.
Silicon Carbide Wafer Polishing Station
Temperature-controlled polishing station for SiC wafers used in power electronics, featuring high-temperature slurries and precise thermal management. Classified HTS 8419.89.95.85 as wafer prep for other semiconductor materials beyond silicon/GaAs.
RF Zone Refiner for Semiconductors
Radio frequency zone refining furnace for ultra-purification of semiconductor rod materials through repeated melting/solidification passes. Falls under HTS 8419.89.95.85 for temperature treatment equipment processing other semiconductor materials.
Edge Grinding Machine for Wafers
Automated edge profiling and grinding machine for semiconductor wafers to prevent chipping during handling, with coolant temperature regulation. HTS 8419.89.95.85 for wafer preparation cooling processes on other materials.
Double-Sided Wafer Lapper
Simultaneous double-sided lapping equipment for semiconductor wafers achieving sub-micron thickness uniformity through synchronized temperature-controlled platens. Classified under HTS 8419.89.95.85 for advanced wafer preparation on other materials.
Stress Relief Annealing Oven for Wafers
Precision annealing furnace for relieving internal stresses in processed semiconductor wafers through controlled heating/cooling cycles. HTS 8419.89.95.85 for temperature treatment of other semiconductor materials post-processing.
Compound Semiconductor Boule Saw
Specialized wire saw for sectioning compound semiconductor boules (GaN, SiC) into wafers with diamond slurry and temperature-controlled wire tensioning. Under HTS 8419.89.95.85 for other materials wafer slicing equipment.
High-Temperature Wafer Cleaner
Megasonic cleaning station using heated chemical baths and temperature-controlled drying for semiconductor wafer surface preparation. Classified HTS 8419.89.95.85 for temperature-based treatment in wafer processing of other materials.
Thermal Oxidation Furnace for Wafers
Horizontal tube furnace for growing silicon dioxide layers on semiconductor wafers through high-temperature steam or dry oxygen ambient. HTS 8419.89.95.85 for other material wafer processing involving precise temperature change processes.
Czochralski Crystal Puller
A machine used to grow monocrystalline silicon boules by pulling a seed crystal from molten silicon in a controlled temperature environment. It falls under HTS 8419.89.95.85 as semiconductor manufacturing equipment for crystal growth involving precise heating and cooling processes on semiconductor materials classified as 'other materials'.
Crystal Boule Grinder
Precision grinder that shapes semiconductor crystal boules to exact wafer diameters and grinds orientation flats indicating conductivity and resistivity. It uses controlled cooling/lubrication systems qualifying under HTS 8419.89.95.85 for wafer preparation equipment involving temperature management on other semiconductor materials.
Semiconductor Wafer Slicing Saw
High-precision diamond saw for slicing ultra-thin wafers from monocrystalline semiconductor boules, featuring coolant circulation systems for temperature stabilization during cutting. Falls under HTS 8419.89.95.85 as wafer preparation equipment for other materials involving cooling processes.
Chemical Mechanical Wafer Polisher
CMP polisher for final surface preparation of semiconductor wafers using chemical slurries and mechanical pressure on temperature-regulated polishing pads. Under HTS 8419.89.95.85 as it involves temperature-controlled polishing in wafer preparation for other materials.