Gallium Arsenide Wafer Grinder from Japan
Specialized grinder for back-thinning GaAs compound semiconductor wafers to device fabrication thicknesses with integrated cooling systems. Specifically HTS 8419.89.95.85 for 'other materials' (non-silicon) wafer preparation equipment.
Duty Rate — Japan → United States
14.2%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Explicitly declare GaAs/compound semiconductor use to qualify for 'other materials' subheading
• Include material safety data for gallium compounds in shipping docs
• Silicon versions use 8419.89.9580; ensure material specificity prevents misclassification