Gallium Arsenide Wafer Grinder from Japan
Specialized grinder for back-thinning GaAs compound semiconductor wafers to device fabrication thicknesses with integrated cooling systems. Specifically HTS 8419.89.95.85 for 'other materials' (non-silicon) wafer preparation equipment.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Explicitly declare GaAs/compound semiconductor use to qualify for 'other materials' subheading
• Include material safety data for gallium compounds in shipping docs
• Silicon versions use 8419.89.9580; ensure material specificity prevents misclassification