8419.89.95.85/Gallium Arsenide Wafer Grinder/Japan

Gallium Arsenide Wafer Grinder from Japan

Specialized grinder for back-thinning GaAs compound semiconductor wafers to device fabrication thicknesses with integrated cooling systems. Specifically HTS 8419.89.95.85 for 'other materials' (non-silicon) wafer preparation equipment.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Explicitly declare GaAs/compound semiconductor use to qualify for 'other materials' subheading

• Include material safety data for gallium compounds in shipping docs

• Silicon versions use 8419.89.9580; ensure material specificity prevents misclassification