8419.89.95.85/Gallium Arsenide Wafer Grinder/Germany

Gallium Arsenide Wafer Grinder from Germany

Specialized grinder for back-thinning GaAs compound semiconductor wafers to device fabrication thicknesses with integrated cooling systems. Specifically HTS 8419.89.95.85 for 'other materials' (non-silicon) wafer preparation equipment.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%

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Import Tips

• Explicitly declare GaAs/compound semiconductor use to qualify for 'other materials' subheading

• Include material safety data for gallium compounds in shipping docs

• Silicon versions use 8419.89.9580; ensure material specificity prevents misclassification